PTCZL09H161SBC052 Vishay, PTCZL09H161SBC052 Datasheet - Page 2

• Manufacturer Part Number: PTCZL09H161SBC052
• Description: PTC Resettable Fuses PTC THERMISTOR
• Manufacturer: Vishay

Specifications of PTCZL09H161SBC052

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PTC OUTLINES
PTC SMD ceramic size: 6.5 mm
DIMENSIONS in millimeters
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes which
can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s
should not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a reinforced version is available on request.
Document Number: 29068
Revision: 27-Oct-09
Reflow soldering
Typical values (solid line)
Process limits (dotted lines)
± 0.15
3.45
(°C)
T
2.8
300
250
200
150
100
50
0
0
1
3.6 ± 0.1
4 ± 0.2
4 ± 0.1
7.2
2
- 0.2
50
0
2 K/s
3
260 °C
max.
10°
100
245 °C
215 °C
180 °C
130 °C
2
3
1.2
150
2
10 s
7.6 ± 0.25
10 ± 0.25
8.0
For technical questions, contact:
40 s
0.6
200
SMD PTC Thermistors For
10 s
+ 0.6
1
0
Overload Protection
t (s)
250
0.2
(°C)
Vapour phase soldering
Typical values (solid line)
Process limits (dotted lines)
DIMENSIONS OF SOLDER LANDS in millimeters
T
MATERIAL INFORMATION
REF.
300
250
200
150
100
1
2
3
50
[e-mail]
0
2381 661 97.../PTCTZ..R....TE
0
preheating
external
215 °C
180 °C
130 °C
100 °C
DESCRIPTION
Metallization
Leadframe
Ceramic
50
internal preheating,
e.g. by infrared,
max. 2 K/s
5
2
100
Vishay BCcomponents
20 to 40 s
Ni plated phosphor bronze material
covered by PbSn8 solder layer
150
MATERIAL AND REMARKS
11
(vacuum deposition)
BaTiO3 doped
NiCr Ag layer
200
forced
cooling
t (s)
250
www.vishay.com
39