MD1803DFX STMicroelectronics, MD1803DFX Datasheet
MD1803DFX
Specifications of MD1803DFX
Available stocks
Related parts for MD1803DFX
MD1803DFX Summary of contents
Page 1
... In compliance with the 2002/93/EC european directive Applications ■ Horizontal deflection output for TV Description The MD1803DFX is manufactured using Diffused Collector in Planar Technology adopting new and enhanced high voltage structure. The new MD product series show improved silicon efficiency bringing updated performance to the Horizontal Deflection stage. ...
Page 2
... Insulation withstand voltage (rms) from all three leads to external V isol heatsink T Storage temperature stg T Max. operating junction temperature J Table 2. Thermal data Symbol R Thermal resistance junction-case ____________________Max thj-case 2/10 Parameter = < 5ms 25°C c Parameter MD1803DFX Value Unit 1500 V 700 2500 V -65 to 150 °C 150 Value Unit 2.2 °C/W ...
Page 3
... MD1803DFX 2 Electrical characteristics (T = 25°C; unless otherwise specified) CASE Electrical characteristics Table 3. Symbol Parameter Collector cut-off current I CES ( Emitter cut-off current I EBO ( Emitter-base breakdown voltage V (BR)EBO ( Collector-emitter saturation CE(sat) voltage Note 1 V BE(sat) Base-emitter saturation voltage Note current gain Note 1 V Diode forward voltage ...
Page 4
... Electrical characteristics 2.1 Electrical characteristics (curve) Figure 1. Safe operating area Figure 3. Output characteristics Figure 5. DC current gain 4/10 Figure 2. Derating curve Figure 4. Reverse biased SOA Figure 6. DC current gain MD1803DFX ...
Page 5
... MD1803DFX Figure 7. Collector-emitter saturation voltage Figure 8. Figure 9. Power losses Base-emitter saturation voltage Figure 10. Inductive load switching time Electrical characteristics 5/10 ...
Page 6
... Electrical characteristics 2.2 Test circuit Figure 11. Power losses and inductive load switching test circuit Figure 12. Reverse biased safe operating area test circuit 6/10 MD1803DFX ...
Page 7
... MD1803DFX 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
Page 8
... D 3.10 D1 1.80 E 0.80 F 0.65 F2 1.80 G 10. 15. 22.80 L3 26.30 L4 43.20 L5 4.30 L6 24.30 L7 14.60 N 1.80 R 3.80 Dia 3.40 8/10 mm. TYP 5.45 9 MD1803DFX MAX. 5.70 3.20 3.50 2.20 1.10 0.95 2.20 11.50 15.70 10.20 23.20 26.70 44.40 4.70 24.70 15 2.20 4.20 3.80 7627132 B ...
Page 9
... MD1803DFX 4 Revision history Table 4. Revision history Date Revision 18-Oct-2005 11-Nov-2005 15-Feb-2006 08-May-2006 23-May-2006 22-Sep-2006 1 First release 2 New Template, no content change 3 Complete version with curves 4 Typo mistake on table1 V value has been changed 5 (BR)EBO New h limit 6 FE Revision history Changes 9/10 ...
Page 10
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com MD1803DFX ...