BDN09-3CB CTS Thermal Management Products

Manufacturer Part Number

BDN09-3CB

Description

HEATSINK CPU .91" SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Not Included)

Outline

23.11mm x 23.11mm

Height

0.35" (9mm)

Thermal Resistance @ Forced Air Flow

9.6°C/W @ 400 LFM

Thermal Resistance @ Natural

26.9°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

Other names

Q3793063