BDN10-3CB/A01 CTS Thermal Management Products, BDN10-3CB/A01 Datasheet
BDN10-3CB/A01
Manufacturer Part Number
BDN10-3CB/A01
Description
HEATSINK CPU W/ADHESIVE 1.01"SQ
Manufacturer
CTS Thermal Management Products
Series
BDNr
Datasheet
1.BDN09-3CBA01.pdf
(2 pages)
Specifications of BDN10-3CB/A01
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
25.65mm x 25.65mm
Height
0.35" (9mm)
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Thermal Resistance @ Natural
26.4°C/W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Other names
294-1098
Peel and Stick Heat Dissipators
NOTES:
• Thermal resistance of adhesive tape is included
• Thermal resistance values based on power densityof 3 watts/in².
• Part numbers listed for standard black anodized heat sinks with IERC adhesive tapes.
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BDN10-3CB/A01 Summary of contents
Page 1
NOTES: • Thermal resistance of adhesive tape is included • Thermal resistance values based on power densityof 3 watts/in². • Part numbers listed for standard black anodized heat sinks with IERC adhesive tapes. Peel and Stick Heat Dissipators ...
Page 2
... HEAT SINK PART NUMBER (W) (L) BDN09-3CB/A01 0.91 0.91 BDN09-6CB/A01 BDN10-3CB/A01 1.01 1.01 BDN10-5CB/A01 BDN11-3CB/A01 1.11 1.11 BDN11-6CB/A01 BDN12-3CB/A01 1.21 1.21 BDN12-5CB/A01 BDN13-3CB/A01 1.31 1.31 BDN13-5CB/A01 BDN14-3CB/A01 1.41 1.41 BDN14-6CB/A01 BDN15-3CB/A01 1.51 1.51 BDN15-5CB/A01 BDN16-3CBA/01 1.61 1.61 BDN16-6CB/A01 BDN17-3CB/A01 1.71 1.71 BDN17-5CB/A01 BDN18-3CB/A01 1 ...