PIC24HJ12GP202-E/SO Microchip Technology, PIC24HJ12GP202-E/SO Datasheet - Page 222
PIC24HJ12GP202-E/SO
Manufacturer Part Number
PIC24HJ12GP202-E/SO
Description
12KB, Flash, 1024bytes-RAM, 40MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(242 pages)
2.PIC24HJ12GP201-ISO.pdf
(8 pages)
3.PIC24HJ12GP201-ISO.pdf
(84 pages)
4.PIC24HJ12GP201-ISO.pdf
(12 pages)
Specifications of PIC24HJ12GP202-E/SO
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164339 - MODULE SKT FOR PM3 28SOICDV164033 - KIT START EXPLORER 16 MPLAB ICD2
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ12GP202-E/SO
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ12GP201-ISO PDF datasheet #2
- PIC24HJ12GP201-ISO PDF datasheet #3
- PIC24HJ12GP201-ISO PDF datasheet #4
- Current page: 222 of 242
- Download datasheet (4Mb)
PIC24HJ12GP201/202
DS70282D-page 220
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Preliminary
Dimension Limits
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
© 2009 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c
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