SST49LF008A-33-4C-EIE Microchip Technology, SST49LF008A-33-4C-EIE Datasheet - Page 21
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SST49LF008A-33-4C-EIE
Manufacturer Part Number
SST49LF008A-33-4C-EIE
Description
3.0V To 3.6V 8Mbit LPC Firmware Flash 40 TSOP 10x20 Mm TRAY
Manufacturer
Microchip Technology
Datasheets
1.SST49LF080A-33-4C-NHE.pdf
(2 pages)
2.SST49LF080A-33-4C-NHE.pdf
(2 pages)
3.SST49LF008A-33-4C-NHE.pdf
(42 pages)
Specifications of SST49LF008A-33-4C-EIE
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
33MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 85°C
Package / Case
40-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SST49LF008A-33-4C-EIE
Manufacturer:
SST
Quantity:
20 000
Part Number:
SST49LF008A-33-4C-EIE-T
Manufacturer:
SST
Quantity:
20 000
8 Mbit Firmware Hub
SST49LF008A
ELECTRICAL SPECIFICATIONS
The AC and DC specifications for the FWH Interface signals (FWH[3:0], CLK, FWH4, and RST#) as defined in Section
4.2.2 of the PCI Local Bus Specification, Rev. 2.1. Refer to Table 10 for the DC voltage and current specifications. Refer
to the tables on pages 23 through 27 for the AC timing specifications for Clock, Read/Write, and Reset operations.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to
Transient Voltage (<20 ns) on Any Pin to Ground Potential
Package Power Dissipation Capability (T
Surface Mount Solder Reflow Temperature
Output Short Circuit Current
O
AC C
©2006 Silicon Storage Technology, Inc.
Range
Commercial
Input Rise/Fall Time . . . . . . . . . . . . . . . 3 ns
Output Load . . . . . . . . . . . . . . . . . . . . . C
See Figures 23 and 24
PERATING
1. Do not violate processor or chipset limitations on the INIT# pin.
2. Excluding certain with-Pb 32-PLCC units, all packages are 260
3. Outputs shorted for no more than one second. No more than one output shorted at a time. This note applies to non-PCI outputs.
1. FWH interface signals use PCI load test conditions
Certain with-Pb 32-PLCC package types are capable of 240
ONDITIONS OF
R
ANGE
Ambient Temp
0°C to +85°C
T
EST
1
3
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
L
= 30 pF
A
3.0-3.6V
=25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
2
V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
°
C for 10 seconds; please consult the factory for the latest information.
°
21
C capable in both non-Pb and with-Pb solder versions.
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to
S71161-11-000
Data Sheet
V
V
DD
DD
+0.5V
+2.0V
3/06