ADV7342BSTZ Analog Devices Inc, ADV7342BSTZ Datasheet - Page 19

• Manufacturer Part Number: ADV7342BSTZ
• Manufacturer: Analog Devices Inc

Specifications of ADV7342BSTZ

• Number Of Dac's: 6
• Adc/dac Resolution: 11b
• Screening Level: Industrial
• Package Type: LQFP
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter
V
V
PV
V
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Maximum CLKIN Input Frequency
Storage Temperature Range (T
Junction Temperature (T
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Analog output short circuit to any power supply or common can be of an
indefinite duration.
AA
DD
DD_IO
DD
to AGND
to DGND
to PGND
to GND_IO
1
J
)
S
)
Rating
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to V
−0.3 V to V
80 MHz
−65°C to +150°C
150°C
260°C
DD_IO
AA
+ 0.3 V
Rev. A | Page 19 of
The ADV7342/ADV7343 are high performance integrated
circuits with an ESD rating of <1 kV, and they are ESD sensitive.
Proper precautions should be taken for handling and assembly.
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance
Package Type
64-Lead LQFP
1
The ADV7342/ADV7343 are RoHS-compliant, Pb-free products.
The lead finish is 100% pure Sn electroplate. The devices are
suitable for Pb-free applications up to 255°C (±5°C) IR reflow
(JEDEC STD-20).
They are backward compatible with conventional SnPb soldering
processes. The electroplated Sn coating can be soldered with
Sn/Pb solder paste at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
θ
Values are based on a JEDEC 4-layer test board.
104
JA
is specified for the worst-case conditions, that is, a device
1
θ
47
JA
ADV7342/ADV7343
θ
11
JC
Unit
°C/W