MT47H256M8HG-37E:A Micron Technology Inc, MT47H256M8HG-37E:A Datasheet - Page 123
MT47H256M8HG-37E:A
Manufacturer Part Number
MT47H256M8HG-37E:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H256M8HG-37EA.pdf
(134 pages)
Specifications of MT47H256M8HG-37E:A
Organization
256Mx8
Address Bus
18b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
150mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M8HG-37E:A
Manufacturer:
Micron
Quantity:
110
Company:
Part Number:
MT47H256M8HG-37E:A
Manufacturer:
MICRON
Quantity:
528
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Figure 75: REFRESH Command-to-Power-Down Entry
Figure 76: ACTIVATE Command-to-Power-Down Entry
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Note:
Note:
Command
Command
Address
1. The earliest precharge power-down entry may occur is at T2, which is 1 ×
1. The earliest active power-down entry may occur is at T2, which is 1 ×
CK#
CKE
CK#
CKE
CK
CK
REFRESH command. Precharge power-down entry occurs prior to
fied.
VATE command. Active power-down entry occurs prior to
Valid
Valid
T0
T0
REFRESH
VALID
ACT
T1
T1
123
1 t CK
1 x t CK
Power-down 1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Power-down 1
entry
entry
NOP
NOP
T2
T2
2Gb: x4, x8, x16 DDR2 SDRAM
t CKE (MIN)
t CKE (MIN)
T3
T3
t
RCD (MIN) being satisfied.
Power-Down Mode
© 2006 Micron Technology, Inc. All rights reserved.
Don’t Care
Don’t Care
t
RFC (MIN) being satis-
t
CK after the ACTI-
t
CK after the
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