MT47H256M8HG-37E:A Micron Technology Inc, MT47H256M8HG-37E:A Datasheet - Page 20
MT47H256M8HG-37E:A
Manufacturer Part Number
MT47H256M8HG-37E:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H256M8HG-37EA.pdf
(134 pages)
Specifications of MT47H256M8HG-37E:A
Organization
256Mx8
Address Bus
18b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
150mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M8HG-37E:A
Manufacturer:
Micron
Quantity:
110
Company:
Part Number:
MT47H256M8HG-37E:A
Manufacturer:
MICRON
Quantity:
528
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Figure 9: 84-Ball FBGA Package (9mm x 12.5mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
Seating
11.2 CTR
plane
84X Ø0.45
0.12 A
0.8 TYP
Notes:
A
9 8 7
Nonconductive overmold
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
1.8 CTR
6.4 CTR
0.8 TYP
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.05
20
12.5 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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