LT3494AEDDB#PBF Linear Technology, LT3494AEDDB#PBF Datasheet - Page 11

• Manufacturer Part Number: LT3494AEDDB#PBF
• Description: IC,SMPS CONTROLLER,VOLTAGE-MODE,BIPOLAR,LLCC,8PIN,PL
• Manufacturer: Linear Technology

Specifications of LT3494AEDDB#PBF

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Pin Count: 8
• Mounting: Surface Mount
• Package Type: DFN EP
• Case Length: 3mm
• Screening Level: Industrial
• Lead Free Status / RoHS Status: Compliant

PACKAGE DESCRIPTION
2.55 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
TOP MARK
PIN 1 BAR
0.25 ± 0.05
0.61 ±0.05
0.200 REF
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10
2.20 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1702 Rev B)
0.50 BSC
8-Lead Plastic DFN (3mm × 2mm)
0.75 ±0.05
2.00 ±0.10
(2 SIDES)
0.70 ±0.05
DDB Package
PACKAGE
OUTLINE
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
0.40 ± 0.10
LT3494/LT3494A
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
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