2-173977-6 TE Connectivity, 2-173977-6 Datasheet - Page 8
![CT CONN MT REC ASSY 6P BLUE](/photos/41/47/414773/pr173977a_sml.jpg)
2-173977-6
Manufacturer Part Number
2-173977-6
Description
CT CONN MT REC ASSY 6P BLUE
Manufacturer
TE Connectivity
Specifications of 2-173977-6
Product Type
Connector
Connector Type
Connector Assembly
Termination Method To Wire/cable
IDC
Sealed
No
Ul File Number
E28476
Csa File Number
LR 7189
Contact - Rated Current (a)
2
Operating Voltage Reference
AC/DC, AC, DC
Operating Voltage (vac)
125
Operating Voltage (vdc)
125
Wire/cable Size (awg)
26 – 28
Profile Height (y-axis) (mm [in])
5.10 [0.200]
Number Of Positions
6
Number Of Rows
1
Centerline (mm [in])
2.00 [0.079]
Mating Retention
Without
Length (x-axis) (mm [in])
14.00 [0.551]
Width (z-axis) (mm [in])
4.60 [0.181]
Contact Type
Socket
Contact Plating, Mating Area, Material
Pre-Tin
Connector Style
Receptacle
Housing Color
Blue
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Agency/standard
UL, CSA
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Wire/Cable
Accepts Wire Insulation Diameter, Range (mm [in])
0.85 – 1.05 [0.0334 – 0.041]
Application Use
Wire-to-Board, Wire-to-Board / Wire-to-Wire, Wire-to-Wire
Contact Transmits (typical Application)
Signal (Data)
Packaging Method
Bag, Box
ASHL-0005- ES REV B
3.8.3 (10)
3.8.3 (11)
3.8.3 (8)
3.8.3 (9)
(11-1)
(11-2)
Para.
3.8.3
3.8.3
Sulfurous Acid
Gas
Solderability
Resistance to
Soldering Heat
Sequence
Testing
Connector
Repeated
Mating
/Unmating
Temperature
Humidity
Cycling
Test Items
AMP Shanghai Ltd.
Tyco Electronics
Termination resistance (low level) shall be
met.
Solderable area shall have a solder coverage
of 90% Min.
No physical damage shall be evident after
testing.
The requirements for the each testing level
shall be met.
After testing, termination resistance (low
level) shall be met.
After testing, termination resistance (low
level) shall be met.
Requirements
Fig. 2 (End)
8 of 12
PAGE
Document No.
108-5218
Subject mated connectors to
sulfurous acid gas atmosphere
of 3±1ppm concentration at
40±2
Subsequent measurement shall
be done after reconditioning in
the room temperature for 1
hour.
Subject contacts to solderability
testing, as specified.
MIL-STD-202, Method 208.
Subject product mounted on
printed circuit boards to solder
bath at 260±5
seconds
MIL-STD-202, Method 210
except as indicated above when
testing by manual soldering
iron, apply it as 350±10
seconds without forcing
pressure to affect the tine of
contact.
SMT product mounted on
printed circuit boards to solder
reflow as like Fig. 7.
See Para. 3.8.3 (11-1) and
Para. 3.8.3 (11-2)
Subject connector assembly to
30 cycles of repeated
mating/unmating at a rate of 10
cycles a minute.
Subject mated connector to
temperature changes between
25
JIS C 0028.
for 5 cycles.
o
C and 65
o
C for 240 hours.
Procedures
o
C with 95 % R.H.
o
C for 10±1
REV
S
o
C for 3
LOC
ES