LTC2635CUD-HMI8#PBF Linear Technology, LTC2635CUD-HMI8#PBF Datasheet - Page 30

• Manufacturer Part Number: LTC2635CUD-HMI8#PBF
• Description: IC DAC 8BIT I2C QUAD 16QFN
• Manufacturer: Linear Technology

Specifications of LTC2635CUD-HMI8#PBF

• Settling Time: 3.5µs
• Number Of Bits: 8
• Data Interface: I²C
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-WQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -

package Description
LTC2635
0
(.0120 .0015)
0.305 0.038
TYP
GAUGE PLANE
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.010)
0.254
(.074 .004)
1.88 0.102
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.0197)
(.066 .004)
1.68 0.102
0.50
BSC
10-Lead Plastic MSOP , Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev D)
(.021 .006)
0.53 0.152
SEATING
0.889 0.127
(.035 .005)
(.126 – .136)
PLANE
3.20 – 3.45
MSE Package
(.118 .004)
3.00 0.102
(.007 – .011)
(.193 .006)
4.90 0.152
0.17 – 0.27
(NOTE 3)
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
0.50
BSC
10
10
1
1 2 3 4 5
9
8
7 6
DETAIL “B”
(.074)
1.88
(.118 .004)
3.00 0.102
(.0196 .003)
0.497 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 0.0508
(.066)
1.68
MSOP (MSE) 0210 REV D
(.004 .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
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