MT47H32M16BN-37E:D Micron Technology Inc, MT47H32M16BN-37E:D Datasheet - Page 24
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MT47H32M16BN-37E:D
Manufacturer Part Number
MT47H32M16BN-37E:D
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16BN-37ED.pdf
(139 pages)
Specifications of MT47H32M16BN-37E:D
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
205mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16BN-37E:D
Manufacturer:
MICRON
Quantity:
489
Company:
Part Number:
MT47H32M16BN-37E:D
Manufacturer:
MICRON
Quantity:
319
Company:
Part Number:
MT47H32M16BN-37E:D TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Seating plane
Solder ball diameter
refers to post-reflow
condition.
Figure 12: 60-Ball FBGA (10mm x 10mm) – x4, x8
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
0.12 C
8.0
60X Ø0.45
C
Note:
10.0 ±0.15
0.80 TYP
1. All dimensions are in millimeters.
6.4
C L
C L
0.8 TYP
0.8 ±0.1
Ball A1 ID
10.0 ±0.15
24
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
1.20 MAX
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging