S19252PBIDB Applied Micro Circuits Corporation, S19252PBIDB Datasheet - Page 57

• Manufacturer Part Number: S19252PBIDB
• Manufacturer: Applied Micro Circuits Corporation

Specifications of S19252PBIDB

• Lead Free Status / Rohs Status: Supplier Unconfirmed

S19252 – 324 PBGA 0.8 mm Pitch Package Mechanical Drawing
Figure 13: S19252 – 324 PBGA 0.8 mm Pitch Package Mechanical Drawing
PACKAGE MATERIAL NOTE:
Standard Package: Ball Composition - 63/37 Sn/Pb.
RoHS Compliant Package: Ball Composition - 96.5/3.0/0.5 Sn/Ag/Cu.
Table 27: Thermal Management (0.8 mm Pitch Package)
1. ja values can be used in conjunction with the desired ambient temperature and device power consumption to determine the available ther-
2. When the device is used without airflow or insufficient airflow, a heatsink is required.
Revision 5.03
mal margin in the device. Consult application note GAN2001 for more details on thermal resistance calculations.
S19252
Device
AppliedMicro - Confidential and Proprietary
8.8 °C/Watt
jc
1
33.4 °C/Watt
28.2 °C/Watt
26.7 °C/Watt
ja
S19252 Data Sheet
100 LFM
200 LFM
Airflow
0 LFM
2
2
2
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