RCGD16589FB Intel, RCGD16589FB Datasheet
RCGD16589FB
Specifications of RCGD16589FB
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RCGD16589FB Summary of contents
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... Intel company General Description GD16585 and GD16589 are transmitter chips used in SDH STM-64 and SONET OC-192 optical communication systems. The device is available in two versions: GD16585 for 9.5328 Gbit/s. u GD16589 for 10.66 Gbit/s with u Forward Error Correction (FEC). Except the different operating bit rate the two versions are functional identical ...
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Functional Details The main function of GD16585/GD16589 is as transmitter in STM-64 /OC-192 and OTN optical communication systems. It integrates: Voltage Controlled Oscillator (VCO) u Phase and Frequency Detector (PFD) u 16:1 Multiplexer u Re-timing of output data. u Phase ...
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If no adjustement is needed the VCUR can be lefted open. With AC coupled outputs the VCUR pin must not be directly connected which may cause the output stage to saturate deteriorating the eye-diagram. Refer to Figure ...
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Application Framer + Out of Lock - Figure 1. Application Information, OIF interface to the Framer. Pin D1 Pin D2 VDD VEE Pin VDDO VEE C is 10nF parallel with ...
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Gbit/s Output Interface GD16585/GD16589 0V 50W -5.2V Figure 3. 10 Gbit/s outputs (OUT/OUTN), DC coupled. GD16585/GD16589 0V 50W -5.2V Figure 4. 10 Gbit/s outputs (OUT/OUTN), AC coupled. Note: With AC coupled outputs VCUR must not be connected directly to ...
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Mbit/s Output Interface GD16585 50 MSL W 8mA -5.2V Figure 5. Open collector output. Open collector outputs should always be terminated at the receiver end, by preferably 50 W. 622 Mbit/s Input Interface LVDS Output Figure 6. LVDS compatible ...
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Pin List Mnemonic: Pin No.: DI0, DIN0 C7, D7 DI1, DIN1 A8, B8 DI2, DIN2 A9, B9 DI3, DIN3 B10, A11 DI4, DIN4 C11, C12 DI5, DIN5 D12, E12 DI6, DIN6 G11, H12 DI7, DIN7 J12, J11 DI8, DIN8 L9, ...
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Mnemonic: Pin No.: VEE B2, C8, C10, D8, D10, J4, J9, K4, K9 VCC D11, J7, J10 (K10 A10, A12, B11-12, C9, D9, F12, G12, K7, K11, L7, L10, M1, M6, M7, M10-12 NC D3-4, J3 Package Pinout ...
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(empty) = VDD Figure 9. Package FB Pinout. Top view seen through the package. Data Sheet Rev ...
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Maximum Ratings These are the limits beyond which the component may be damaged. All voltages in table are referred to VDD/VDDA. All currents are defined positive out of the pin. VDD GND Symbol: Characteristic: V Negative ...
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DC Characteristics ° °C. VEE = -5.2 V. VCC = +3.3 V. VDD GND. CASE All voltages in table are referred to VDD. All currents are defined positive out of ...
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AC Characteristics, General ° °C, VEE = -5.2 V. VCC = +3.3 V. CASE Symbol: Characteristic: J Jitter transfer TRF J Jitter generation GEN V 10 Gbit/s output voltage OUT OUT/OUTN output reflection coefficient G ...
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AC Characterisitcs, Source Synchronous Clocking - OIF99.102 ° °C, VEE = -5.2 V. CASE Framer OIF99.102.5 TXDATA TXCLK TXCLK_SRC 2 -5.2 V 155/622 MHz Figure 10. OIF interface. CKI DI0-15 Figure 11. Timing relation ...
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AC Characteristics, Forward Clocking to System ASIC ° °C, VEE = -5.2 V. CASE System ASIC TXDATA TXCLK -5.2 V Figure 12. Forward clocking with phase nulling circuit. CKI CKOUT DI0-15 0 Figure ...
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Package Outline EF - Package Figure 14. Package 132 ball Ceramic BGA (EB and EF package). Data Sheet Rev.: 13 GD16585/GD16589 Page ...
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Figure 15. Package 132 ball Plastic BGA (FB package). Data Sheet Rev.: 13 GD16585/GD16589 Page ...
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... Please check our Internet web site for latest version of this data sheet. GD16589-<XX> <Wafer #>-<Lot #> <Intel FPO #> <Die ID> Package Type: Intel Order Number: HCGD16585EB 132 ball (16 mil) Ceramic BGA MM# 835479 HCGD16585EF 132 ball (20 mil) Ceramic BGA MM# 837348 RCGD16585FC ...