GWIXP460BAD Intel, GWIXP460BAD Datasheet - Page 40

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GWIXP460BAD

Manufacturer Part Number
GWIXP460BAD
Description
Manufacturer
Intel
Datasheet

Specifications of GWIXP460BAD

Core Operating Frequency
533MHz
Operating Supply Voltage (typ)
1.3/1.5/2.5/3.3V
Operating Supply Voltage (max)
1.575/2.7/3.465V
Operating Supply Voltage (min)
1.235/2.3/3.135V
Package Type
BGA
Pin Count
544
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Package Information
4.0
4.1
4.1.1
May 2005
40
Package Information
This section contains information on the following topics:
Package Description
The IXP45X/IXP46X network processors are built using a 544-ball, plastic ball grid array (PBGA)
package with a drop-in heat spreader (H).
For all extended temperature products and the 667-MHz speed option of the commercial
temperature product, a 10-mm-high, thermal-adhesive-based heat sink will be required. The heat
sink does not force the addition of any surface area to the board design.
Package Drawings
The package is shown in
“Package Description”
Numbers”
“Functional Signal Definitions” on page 46
“Signal-Pin Descriptions” on page 89
“Package Thermal Specifications” on page 114
Figure 5
Intel
which includes
®
IXP45X and Intel
and
Figure
“Package
6.
®
IXP46X Product Line of Network Processors Datasheet
Drawings”,
“Package
Document Number:
Markings”, and
306261-002
“Part

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