EWIXP420ABBT Intel, EWIXP420ABBT Datasheet - Page 62

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EWIXP420ABBT

Manufacturer Part Number
EWIXP420ABBT
Description
Manufacturer
Intel
Datasheet

Specifications of EWIXP420ABBT

Core Operating Frequency
533MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant

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6.2.1
Figure 24.
Figure 25.
Intel
Hardware Design Guidelines
62
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
General Component Spacing
Good Design Practice for VIA Hole Placement
Figure 24
surface-mount boards.
Figure 26
components and PGA or BGA components.
Poor Design Practice for VIA Placement
• Maintain a minimum of component pad spacing of 100 mils for auto-insertion
• Do not place any components within 125 mils of the printed circuit board edge. This
• The minimum spacing between the via and the solder pad is 25 mils.
equipment for mixed assemblies.
is required to bed-of-nails test fixture.
Intel
®
and
shows minimum pad-to-pad clearance for surface-mount passive
IXP42X product line and IXC1100 control plane processors—General Layout and Routing
25 mils min
Figure 25
25 mils min
show good and poor design practices for via placement on
Flush Via min
25 mils min
Potential Bridge min
Document Number: 252817-008US
B2267-01
December 2007
B2266-01
Guide