AD9787BSVZ Analog Devices Inc, AD9787BSVZ Datasheet - Page 6
![IC DAC 14BIT 800MSPS 100TQFP](/photos/6/60/66082/sv-100-1_sml.jpg)
AD9787BSVZ
Manufacturer Part Number
AD9787BSVZ
Description
IC DAC 14BIT 800MSPS 100TQFP
Manufacturer
Analog Devices Inc
Series
TxDAC®r
Datasheet
1.AD9785BSVZ.pdf
(64 pages)
Specifications of AD9787BSVZ
Data Interface
Serial
Number Of Bits
14
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
450mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
Resolution (bits)
14bit
Sampling Rate
800MSPS
Input Channel Type
Parallel
Digital Ic Case Style
QFP
No. Of Pins
100
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Settling Time
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9787BSVZ
Manufacturer:
ADI
Quantity:
200
Company:
Part Number:
AD9787BSVZ
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Company:
Part Number:
AD9787BSVZRL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
AD9785/AD9787/AD9788
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD33 to AGND, DGND, CGND
DVDD33, DVDD18, CVDD18
AGND to DGND, CGND
DGND to AGND, CGND
CGND to AGND, DGND
I120, VREF, IPTAT to AGND
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
P1D[15] to P1D[0], P2D[15] to P2D[0]
DATACLK, TXENABLE to DGND
REFCLK+, REFCLK−, RESET, IRQ,
RESET, IRQ, PLL_LOCK, SYNC_O+,
Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
to AGND, DGND, CGND
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
to DGND
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CSB, SCLK, SPI_SDIO, SPI_SDO
to DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
125°C
−65°C to +150°C
Rev. A | Page 6 of 64
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance
θ
θ
θ
ESD CAUTION
JA
JB
JC
Unit
19.1°C/W
12.4°C/W
7.1°C/W
Conditions
EPAD soldered. No airflow.
EPAD soldered. No airflow.
EPAD soldered. No airflow.