SAF7841HL/M295,557 NXP Semiconductors, SAF7841HL/M295,557 Datasheet - Page 43

• Manufacturer Part Number: SAF7841HL/M295,557
• Description: IC HD RADIO PROCESSOR 144HLQFP
• Manufacturer: NXP Semiconductors

Specifications of SAF7841HL/M295,557

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288157557

NXP Semiconductors
TDA8954_1
Product data sheet
17.4 Package related soldering information
Table 15.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Rev. 01 — 24 December 2009
Soldering method
Dipping
-
suitable
-
2 × 210 W class-D power amplifier
Wave
suitable
suitable
not suitable
TDA8954
© NXP B.V. 2009. All rights reserved.
[1]
43 of 46