EP3SL150F780C4N Altera, EP3SL150F780C4N Datasheet - Page 410

IC STRATIX III FPGA 150K 780FBGA

EP3SL150F780C4N

Manufacturer Part Number
EP3SL150F780C4N
Description
IC STRATIX III FPGA 150K 780FBGA
Manufacturer
Altera
Series
Stratix® IIIr

Specifications of EP3SL150F780C4N

Number Of Logic Elements/cells
142500
Number Of Labs/clbs
5700
Total Ram Bits
6390
Number Of I /o
488
Voltage - Supply
0.86 V ~ 1.15 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Stratix III
Number Of Logic Blocks/elements
142500
# I/os (max)
488
Frequency (max)
450MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.1V
Logic Cells
142500
Ram Bits
6543360
Operating Supply Voltage (min)
1.05V
Operating Supply Voltage (max)
1.15V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
For Use With
544-2568 - KIT DEVELOPMENT STRATIX III
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2403
EP3SL150F780C4NES

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13–12
Figure 13–9. SAMPLE/PRELOAD Shift Data Register Waveforms
Note to
(1) Data stored in boundary-scan register is shifted out of TDO.
(2) After boundary-scan register data has been shifted out, data entered into TDI will shift out of TDO.
Stratix III Device Handbook, Volume 1
Figure
TAP_STATE
TMS
TDO
TCK
TDI
13–9:
SHIFT_IR
Instruction Code
During the capture phase, multiplexers preceding the capture registers select the
active device data signals. This data is then clocked into the capture registers. The
multiplexers at the outputs of the update registers also select active device data to
prevent functional interruptions to the device. During the shift phase, the
boundary-scan shift register is formed by clocking data through the capture registers
around the device periphery and then out of the TDO pin. The device can
simultaneously shift new test data into TDI and replace the contents of the capture
registers. During the update phase, data in the capture registers is transferred to the
update registers. You can then use this data in the EXTEST instruction mode. Refer to
“EXTEST Instruction Mode” on page 13–13
Figure 13–9
instruction code is shifted in through the TDI pin. The TAP controller advances to the
CAPTURE_DR state and then to the SHIFT_DR state, where it remains if TMS is held
low. The data that was present in the capture registers after the capture phase is
shifted out of the TDO pin. New test data shifted into the TDI pin appears at the TDO
pin after being clocked through the entire boundary-scan register. If TMS is held high
on two consecutive TCK clock cycles, the TAP controller advances to the UPDATE_DR
state for the update phase.
EXIT1_IR
shows the SAMPLE/PRELOAD waveforms. The SAMPLE/PRELOAD
UPDATE_IR
SELECT_DR
CAPTURE_DR
Chapter 13: IEEE 1149.1 (JTAG) Boundary-Scan Testing in Stratix III Devices
(1)
for more information.
IEEE Std. 1149.1 BST Operation Control
SHIFT_DR
© July 2010 Altera Corporation
(2)
UPDATE_DR
EXIT1_DR

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