EP3SL150F1152C3N Altera, EP3SL150F1152C3N Datasheet - Page 213
![IC STRATX III FPGA 150K 1152FBGA](/photos/6/72/67293/544-1152-fbga_sml.jpg)
EP3SL150F1152C3N
Manufacturer Part Number
EP3SL150F1152C3N
Description
IC STRATX III FPGA 150K 1152FBGA
Manufacturer
Altera
Series
Stratix® IIIr
Datasheets
1.EP3SL150F780C4N.pdf
(16 pages)
2.EP3SL150F780C4N.pdf
(332 pages)
3.EP3SL150F780C4N.pdf
(456 pages)
Specifications of EP3SL150F1152C3N
Number Of Logic Elements/cells
142500
Number Of Labs/clbs
5700
Total Ram Bits
6390
Number Of I /o
744
Voltage - Supply
0.86 V ~ 1.15 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
For Use With
544-2568 - KIT DEVELOPMENT STRATIX III
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2408
EP3SL150F1152C3NES
EP3SL150F1152C3NES
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3SL150F1152C3N
Manufacturer:
ALTERA
Quantity:
490
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Chapter 7: Stratix III Device I/O Features
Stratix III I/O Banks
Figure 7–3. Number of I/Os in Each Bank in the 780-pin FineLine BGA Package
Notes to
(1) All I/O pin counts include dedicated clock inputs pins. The pin count includes all general purpose I/O, dedicated clock pins, and dual-purpose
(2)
(3) Number of I/Os in each Bank in EP3SL50,EP3SL70, EP3SL110, EP3SL150, EP3SE50, EP3SE80 and EP3SE110 in the 780-pin FineLine BGA
(4) Number of I/Os in each Bank in EP3SL200 and EP3SE260 in the 780-pin Hybrid FineLine BGA package.
© July 2010
configuration pins. Dedicated configuration pins are not included in the pin count.
Figure 7–3
package.
Figure
Altera Corporation
is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
7–3:
Number
of I/Os
32
26
26
32
Name
Bank 1C
Bank
Bank 1A
Bank 2C
Bank 2A
EP3SE110
EP3SE260
EP3SL110
EP3SL150
EP3SL200
EP3SL50
EP3SL70
EP3SE50
EP3SE80
Bank 6A
Bank 6C
Bank 5C
Bank 5A
Name
Bank
(Note
Number
of I/Os
1), (2), (3),
32
32
26
26
Stratix III Device Handbook, Volume 1
(4)
7–9
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