EP3SL150F1152C3N Altera, EP3SL150F1152C3N Datasheet - Page 279

IC STRATX III FPGA 150K 1152FBGA

EP3SL150F1152C3N

Manufacturer Part Number
EP3SL150F1152C3N
Description
IC STRATX III FPGA 150K 1152FBGA
Manufacturer
Altera
Series
Stratix® IIIr

Specifications of EP3SL150F1152C3N

Number Of Logic Elements/cells
142500
Number Of Labs/clbs
5700
Total Ram Bits
6390
Number Of I /o
744
Voltage - Supply
0.86 V ~ 1.15 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
For Use With
544-2568 - KIT DEVELOPMENT STRATIX III
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2408
EP3SL150F1152C3NES

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Chapter 8: External Memory Interfaces in Stratix III Devices
Stratix III External Memory Interface Features
Figure 8–15. Avoiding a Glitch on a Non-Consecutive Read Burst Waveform
Leveling Circuitry
© March 2010 Altera Corporation
Postamble Enable
dqsenable
DQS
Using the HDR block as the first stage capture register in the postamble enable
circuitry block is optional. The HDR block is clocked by the half-rate
resynchronization clock, which is the output of the I/O clock divider circuit (shown in
Figure 8–20 on page
that is used to avoid postamble glitches from a previous read burst on a
non-consecutive read burst. This scheme allows a half-a-clock cycle latency for
dqsenable assertion and zero latency for dqsenable deassertion, as shown in
Figure
DDR3 SDRAM unbuffered modules use a fly-by clock distribution topology for better
signal integrity. This means that the CK/CK# signals arrive at each DDR3 SDRAM
device in the module at different times. The difference in arrival time between the first
DDR3 SDRAM device and the last device on the module can be as long as 1.6 ns.
Figure 8–16
8–15.
shows the clock topology in DDR3 SDRAM unbuffered modules.
8–35). There is an AND gate after the postamble register outputs
Postamble
Stratix III Device Handbook, Volume 1
Postamble glitch
Preamble
Delayed by
1/2T logic
8–31

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