EP3SL150F1152C3N Altera, EP3SL150F1152C3N Datasheet - Page 450
![IC STRATX III FPGA 150K 1152FBGA](/photos/6/72/67293/544-1152-fbga_sml.jpg)
EP3SL150F1152C3N
Manufacturer Part Number
EP3SL150F1152C3N
Description
IC STRATX III FPGA 150K 1152FBGA
Manufacturer
Altera
Series
Stratix® IIIr
Datasheets
1.EP3SL150F780C4N.pdf
(16 pages)
2.EP3SL150F780C4N.pdf
(332 pages)
3.EP3SL150F780C4N.pdf
(456 pages)
Specifications of EP3SL150F1152C3N
Number Of Logic Elements/cells
142500
Number Of Labs/clbs
5700
Total Ram Bits
6390
Number Of I /o
744
Voltage - Supply
0.86 V ~ 1.15 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
For Use With
544-2568 - KIT DEVELOPMENT STRATIX III
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2408
EP3SL150F1152C3NES
EP3SL150F1152C3NES
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3SL150F1152C3N
Manufacturer:
ALTERA
Quantity:
490
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16–6
External Pin Connections
Conclusion
Stratix III Device Handbook, Volume 1
The Stratix III TSD, located in the top-right corner of the die, requires two pins for
voltage reference. Connect the TEMPDIODEP and TEMPDIODEN pins to the external
analog-to-digital converter, as shown in
Figure 16–2. TEMPDIODEP and TEMPDIODEN External Pin Connections
The TSD is a very sensitive circuit which can be influenced by the noise coupled from
traces on the board, and possibly within the device package itself, depending on
device usage. The interfacing device registers temperature based on milivolts of
difference as seen at the TSD. Switching I/O near the TSD pins can affect the
temperature reading. Altera recommends you take temperature readings during
periods of no activity in the device (for example, standby mode where no clocks are
toggling in the device), such as when the nearby I/Os are at a DC state and the clock
networks in the device are disabled.
Figure 16–3. TSD Connections
As process geometries get smaller, power and thermal management is becoming more
crucial in FPGA designs. Stratix III devices offer programmable power technology
and selectable core voltage options for low-power operation. Use these features, along
with speed grade choices, in different permutations to get the best power and
performance combination. Taking advantage of the silicon, the Quartus II software is
able to manipulate designs to use the best combination to achieve the lowest power at
the required performance.
For thermal management, use the Stratix III temperature sensing diode with an
external analog-to-digital converter in production devices. This allows you to easily
incorporate this feature in your designs. Being able to monitor the junction
temperature of the device at any time also allows you to control air flow to the device
and save power for the whole system.
Chapter 16: Programmable Power and Temperature-Sensing Diodes in Stratix III Devices
Temperature-Sensing
Device
Stratix III
TSD
TEMPDIODEP
TEMPDIODEN
TEMPDIODEN
TEMPDIODEP
Figure
16–2.
Temperature
Sensing device
Stratix III
© February 2009 Altera Corporation
Conclusion
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