EP3C16F484C7N Altera, EP3C16F484C7N Datasheet - Page 39
![IC CYCLONE III FPGA 16K 484FBGA](/photos/6/72/67258/544-484-fbga_sml.jpg)
EP3C16F484C7N
Manufacturer Part Number
EP3C16F484C7N
Description
IC CYCLONE III FPGA 16K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C10M164C8N.pdf
(350 pages)
7.EP3C16F484C7N.pdf
(274 pages)
Specifications of EP3C16F484C7N
Number Of Logic Elements/cells
15408
Number Of Labs/clbs
963
Total Ram Bits
516096
Number Of I /o
346
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
15408
# I/os (max)
346
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
15408
Ram Bits
516096
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
963
Family Type
Cyclone III
No. Of I/o's
346
I/o Supply Voltage
3.3V
Operating Frequency Max
437.5MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200P0037 - BOARD DEV/EDUCATION ALTERA DE0544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2473
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C16F484C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Design and Compilation
I/O Considerations
© November 2008 Altera Corporation
f
Architectural Optimization
Use specific device architecture features to reduce power consumption. For example,
use the dedicated DSP block available in the Cyclone III device in place of LEs to
perform arithmetic-related functions; build large shift registers from RAM-based
FIFO buffers instead of building the shift registers from the LE registers.
Cyclone III devices offer increased system integration with enhancements in I/O
flexibility and improvements in features. I/O capabilities of the FPGA device, board
layout guidelines, and signal integrity concerns significantly influence pin location
decisions and other types of assignments for each of your design pins. You can
optimize I/O resources for performance and cost while avoiding undesirable signal
issues with the tools and taking into account considerations described in this section.
I/O Tools
I/O design flow includes creating pin-related assignments and validating them
against pin placement guidelines. Use the Pin Planner and Assignment Editor tools in
the Quartus II software to help you through the pin-related assignment creation and
editing. I/O Assignment Analysis helps you to check the legality of the pin
assignments. The following subsections discuss the tools used to create and edit
pin-related assignments.
Pin Planner
The Pin Planner is used to create and edit pin-related assignments. Use the Pin
Planner Package View to make pin location and other assignments using a device
package view instead of pin numbers. With the Pin Planner, you can visually identify
I/O banks, V
pins in the Package View helps you to minimize signal breakout congestion on board
layout when making pin location assignments.
Complementing the Pin Planner is the Pad View window, which displays the pads in
the order around the silicon die. Package pins are connected to pads located on the
perimeter of the top metal layer of the silicon die. Note the pad location where your
pins were assigned, because some pin placement rules describe pad placement
restrictions. Use the Pad View window to guide your pin placement decisions to
maintain good signal integrity for the interface in your design.
The Pin Migration View in the Pin Planner tool shows the pins that will change
function in a migration device if you select one or more migration devices for your
project. It helps you to identify the differences in pins which can exist between
migration devices.
For details about using the Package View, Pad View, and Pin Migration View in the
Pin Planner tool, refer to the Using the Pin Planner section of the
chapter in volume 2 of the Quartus II Handbook.
Assignment Editor
While the Pin Planner provides an intuitive graphical representation of the targeted
device, the Assignment Editor provides a spreadsheet-like interface that allows you to
create and change all pin-related assignments.
REF
groups, and differential pin pairings. The visual representation of
I/O Management
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