KC80524KX366128SL3C7 Intel, KC80524KX366128SL3C7 Datasheet - Page 38

• Manufacturer Part Number: KC80524KX366128SL3C7
• Description: IC MPU 1.6V CELER 366MHZ 615-BGA
• Manufacturer: Intel

Specifications of KC80524KX366128SL3C7

• Rohs Status: RoHS non-compliant
• Processor Type: Celeron
• Features: 66MHz Bus, 128K L2 Cache
• Speed: 366MHz
• Voltage: 1.6V
• Mounting Type: Surface Mount
• Package / Case: 615-BGA
• Other names: 822451

5.2
The TTP on the CPU and the 82433BX provides heat
dissipation and a thermal attach point where a system
manufacturer can attach a heat pipe, a heat spreader plate,
or a thermal solution to transfer heat through the notebook
system. See Figure 14 and Figure 15 for attachment
dimensions from the thermal interface block to the TTP.
When attaching the mating block to the TTP, a thermal
elastimer or thermal grease should be used. This material
reduces the thermal resistance. The thermal interface block
should be secured with 2.0-millimeter screws using a
maximum torque of 1.5 Kg*cm to 2.0 Kg*cm (equivalent to
Thermal Transfer Plate
Figure 14. Thermal Transfer Plate (A)
0.147 N*m to.197 N*m). The thread length of the 2.00-
millimeter screws should be 2.25-millimeter gageable thread
(2.25-millimeters minimum to 2.80-millimeters maximum).
The system manufacturer should use the exact dimensions
for maximum contact area to the TTP to ensure that no
warpage of the TTP occurs. If warpage occurs, the thermal
resistance of the module could be adversely affected.
The TTP thermal resistance between the processor core to
the system interface (top of the TTP) is less than 1 Celsius
per watt.
Intel Celeron
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Processor Mobile Module MMC-1
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