MC7457VG867NC Freescale Semiconductor, MC7457VG867NC Datasheet - Page 43
MC7457VG867NC
Manufacturer Part Number
MC7457VG867NC
Description
IC MPU RISC 867MHZ 483FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7457VG867NC.pdf
(72 pages)
Specifications of MC7457VG867NC
Processor Type
MPC74xx PowerPC 32-Bit
Speed
867MHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
483-FCCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC7457VG867NC
Manufacturer:
Freescale Semiconductor
Quantity:
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8
The following sections provide the package parameters and mechanical dimensions for the CBGA
package.
8.1
The package parameters are as provided in the following list. The package type is 25
ceramic ball grid array (CBGA).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height 2.72 mm
Maximum module height3.24 mm
Ball diameter
Package Parameters for the MPC7447, 360 CBGA
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
25
360 (19
1.27 mm (50 mil)
0.89 mm (35 mil)
×
25 mm
×
19 ball array – 1)
×
25 mm, 360-lead
Package Description
43
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