CM600DXL-24S Powerex Inc, CM600DXL-24S Datasheet - Page 4
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CM600DXL-24S
Manufacturer Part Number
CM600DXL-24S
Description
IGBT MODULE NX-SERIES DUAL
Manufacturer
Powerex Inc
Type
Dualr
Datasheet
1.CM600DXL-24S.pdf
(6 pages)
Specifications of CM600DXL-24S
Prx Availability
RequestQuote
Voltage
1200V
Current
600A
Circuit Configuration
Dual
Rohs Compliant
Yes
Recommended Gate Driver
VLA500-01
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CM600DXL-24S
Manufacturer:
MITSUBISHI
Quantity:
1 000
4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
CM600DXL-24S
Dual IGBTMOD™ NX-S Series Module
600 Amperes/1200 Volts
Electrical Characteristics, T
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink
Mechanical Characteristics
Mounting Torque
Creepage Distance
Clearance
Weight
Flatness of Baseplate
Recommended Operating Conditons, T
(DC) Supply Voltage
Gate (-Emitter Drive) Voltage
External Gate Resistance
*2 Case temperature (T
*6 B
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
R
R
(25/50)
25
50
; Resistance at Absolute Temperature T
; Resistance at Absolute Temperature T
= In(
R
R
50
25
)/(
*2
T
C
25
1
) and heatsink temperature (T
–
T
50
1
MOUNTING SIDE
)
LABEL SIDE
25
50
j
[K]; T
[K]; T
= 25°C unless otherwise specified (continued)
*2
*2
25
50
s
) is measured on the surface
= 25 [°C] + 273.15 = 298.15 [K]
= 50 [°C] + 273.15 = 323.15 [K]
X
MOUNTING SIDE
R
R
B
V
Symbol
R
Y
∆R/R
th(j-c)
th(j-c)
GE(on)
(25/50)
V
R
P
th(c-f)
R
M
– : CONCAVE
+ : CONVEX
M
d
d
e
m
CC
25
25
G
s
a
c
s
t
a
Q
D
= 25°C
Mounting to Heatsink, M5 Screw
Applied Across G1-Es1 / G2-Es2
Approximate by Equation
T
C
Main Terminals, M6 Screw
Thermal Grease Applied
= 100°C, R
Per Inverter FWDi
Per Inverter IGBT
Terminal to Baseplate
Terminal to Baseplate
Applied Across C1-E2
Terminal to Terminal
Terminal to Terminal
On Centerline X, Y
Test Conditions
T
T
(Per 1 Module)
C
C
Per Switch
= 25°C
= 25°C
100
*2
*2
= 493Ω
*7
20.9
32.6
46.0
72.6
86.0
*8
*6
0
LABEL SIDE
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
98.6
Di1
Tr1
93.9
Di2
Tr2
4.85
Min.
13.5
-7.3
31
22
±0
—
—
—
—
—
—
—
—
—
—
—
0
81.8
Th
57.6
Di1
Tr1
53.2
Di2
Tr2
0.007
3375
5.00
15.0
Typ.
690
600
35
27
—
—
—
—
—
—
—
—
—
—
27.2
Di1
Tr1
22.9
Di2
Tr2
0.033
0.063
±100
0
0
Max.
5.15
+7.8
16.5
850
6.8
10
40
31
—
—
—
—
—
—
—
0
26.4
40.0
72.2
85.8
12/11 Rev. 4
Grams
Volts
Volts
Units
K/W
K/W
K/W
in-lb
in-lb
mW
mm
mm
mm
mm
µm
kΩ
%
K
Ω