PCA9506DGG,518 NXP Semiconductors, PCA9506DGG,518 Datasheet
PCA9506DGG,518
Specifications of PCA9506DGG,518
PCA9506DGG-T
PCA9506DGG-T
Related parts for PCA9506DGG,518
PCA9506DGG,518 Summary of contents
Page 1
PCA9506 40-bit I Rev. 01 — 14 February 2006 1. General description The PCA9506 provides 40-bit parallel input/output (I/O) port expansion for I applications organized in 5 banks of 8 I/Os supply voltage, the outputs are capable ...
Page 2
Philips Semiconductors Designed for live insertion Minimize line disturbance (I Signal transient rejection (50 ns noise filter and robust I Low standby current +85 C operation ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM ...
Page 3
Philips Semiconductors 5. Block diagram SCL SDA RESET Fig 1. Block diagram of PCA9506 9397 750 14939 Product data sheet 40-bit I PCA9506 LOW PASS INPUT FILTERS POWER-ON RESET All I/Os are set ...
Page 4
Philips Semiconductors write configuration Fig 2. Simplified schematic of IO0_0 to IO4_7 9397 750 14939 Product data sheet 40-bit I I/O configuration register data from D Q shift register CK Q pulse data from D Q shift register write pulse ...
Page 5
Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration for TSSOP56 9397 750 14939 Product data sheet 2 40-bit I C-bus I/O port with RESET, OE, and INT 1 SDA SCL 2 IO0_0 3 4 IO0_1 5 IO0_2 ...
Page 6
Philips Semiconductors Fig 4. Pin configuration for HVQFN56 6.2 Pin description Table 2: Symbol SDA SCL IO0_0 to IO0_7 IO1_0 to IO1_7 IO2_0 to IO2_7 IO3_0 to IO3_7 IO4_0 to IO4_7 9397 750 ...
Page 7
Philips Semiconductors Table 2: Symbol OE INT RESET [1] HVQFN package die supply ground is connected to both V be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs ...
Page 8
Philips Semiconductors The lowest 6 bits are used as a pointer to determine which register will be accessed. The registers are: • IP: Input Port registers (5 registers) • OP: Output Port registers (5 registers) • PI: Polarity Inversion registers ...
Page 9
Philips Semiconductors 7.3 Register definitions Table 3: Register summary Register # (hex) Input Port registers ...
Page 10
Philips Semiconductors Table 3: Register summary …continued Register # (hex) Mask Interrupt registers ...
Page 11
Philips Semiconductors 7.3.2 OP0 to OP4 - Output Port registers These registers reflect the outgoing logic levels of the pins defined as outputs by the I/O Configuration register. Bit values in these registers have no effect on pins defined as ...
Page 12
Philips Semiconductors 7.3.4 IOC0 to IOC4 - I/O Configuration registers These registers configure the direction of the I/O pins. Cx[ The corresponding port pin is an output. Cx[ The corresponding port pin is an input. Where ...
Page 13
Philips Semiconductors 7.6 Interrupt output (INT) The open-drain active LOW interrupt is activated when one of the port pins changes state and the port pin is configured as an input and the interrupt not masked. The interrupt ...
Page 14
Philips Semiconductors 8. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...
Page 15
Philips Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 9. System configuration 8.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...
Page 16
SDA output bank START condition register bank 0 R selected acknowledge from slave acknowledge ...
Page 17
SDA START condition R acknowledge from slave The programming becomes effective at the acknowledge. Less ...
Page 18
Philips Semiconductors 9. Application design-in information V DD 1 (optional) MASTER CONTROLLER SCL SDA RESET INT OE GND Device address configured as 0100 000X for this example. IO0_0, IO0_2, IO0_3, IO1_0 to IO3_7 are configured ...
Page 19
Philips Semiconductors 10. Limiting values Table 9: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD V input voltage I I input current I V input/output voltage on any other pin ...
Page 20
Philips Semiconductors Table 10: Static characteristics Symbol Parameter I/Os V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level output current OL I total ...
Page 21
Philips Semiconductors 12. Dynamic characteristics Table 11: Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a STOP and BUF START condition t hold time (repeated) START HD;STA condition t set-up time for a repeated ...
Page 22
Philips Semiconductors [5] The maximum t for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t f 250 ns. This allows series protection resistors to be connected between ...
Page 23
Philips Semiconductors START SCL SDA RESET rec(rst) IOx_y Fig 18. Reset timing 13. Test information Fig 19. Test circuitry for switching times 9397 750 14939 Product data sheet 40-bit PULSE GENERATOR R ...
Page 24
Philips Semiconductors 14. Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. ...
Page 25
Philips Semiconductors HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 0.85 mm terminal 1 index area terminal 1 56 index area DIMENSIONS (mm are ...
Page 26
Philips Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However totally safe desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC24 ...
Page 27
Philips Semiconductors • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to ...
Page 28
Philips Semiconductors [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may ...
Page 29
Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
Page 30
Philips Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...