MT47H256M4CF-3:H Micron Technology Inc, MT47H256M4CF-3:H Datasheet - Page 24
MT47H256M4CF-3:H
Manufacturer Part Number
MT47H256M4CF-3:H
Description
IC DDR2 SDRAM 1GBIT 60FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT47H256M4CF-3H.pdf
(134 pages)
Specifications of MT47H256M4CF-3:H
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (256M x 4)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M4CF-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
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Table 6: Temperature Limits
Figure 11: Example Temperature Test Point Location
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 11. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
in Figure 11.
tion.
Lmm x Wmm FBGA
Width (W)
0.5 (W)
0.5 (L)
Length (L)
Electrical Specifications – Absolute Ratings
24
STG
Symbol
C
T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
T
T
T
T
T
STG
is measured in the center of the package, as shown
A
A
C
C
C
1Gb: x4, x8, x16 DDR2 SDRAM
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during opera-
Notes
2, 3, 4
2, 3, 4
2, 3
4, 5
4, 5
1
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