LFXP6C-3F256I Lattice, LFXP6C-3F256I Datasheet - Page 349
LFXP6C-3F256I
Manufacturer Part Number
LFXP6C-3F256I
Description
IC FPGA 5.8KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP6C-3F256I
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
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Part Number:
LFXP6C-3F256I
Manufacturer:
Lattice Semiconductor Corporation
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The above information was specified under the following environmental conditions:
The goal of this exercise is to compute the following device I/O constraints:
The only parameter which can be obtained from the above is the device junction temperature:
The required constraints can be computed as follows:
1. Input setup specification
2. Input hold specification
3. Output maximum propagation delay requirement
4. Output minimum propagation delay requirement
5. Output loading
The preference file to use for this example is shown in Figure 17-3. For more preference language syntax and
examples, refer to the Constraints & Preferences section of the ispLEVER on-line help system.
• Board trace AC loading (Cbac): 60 pf.
• Board trace parasitic capacitance (Cb): 5 pf.
• Port controller input capacitance (Cp) :9 pf.
• FPGA device input capacitance (Co): 9 pf.
• Maximum ambient temperature (Ta): 70 (C.
• Estimated Power Consumption (Q): 2 W.
• 680 PBGAM Package Thermal resistance (j) at 0 feet per minute (fpm) airflow: 13.4 °C/W.
1. Input setup specification.
2. Input hold specification.
3. Maximum output propagation delay.
4. Minimum output propagation delay.
5. Output loading.
6. Temperature.
Tj = j * Q - Ta
= 13.4 * 2 + 70
= 96.8 °C
= P - PDMAXp - PDMAXb - Tskew
= 30 - 18 - 2 - 1
= 9 ns
= PDMINp + PDMINb - Tskew
= 3 + 1 - 1
= 3 ns
= P - TSp - PDMAXb - Tskew
= 30 - 5 - 6 - 1
= 18 ns
= Thp - PDMINb + Tskew
= 3 - 1 + 1
= 3 ns
= Cbac + Cb + Cp
= 60 + 5 + 9
= 74 pf
17-5
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