AM29LV800DT-70EC AMD (ADVANCED MICRO DEVICES), AM29LV800DT-70EC Datasheet - Page 46

• Manufacturer Part Number: AM29LV800DT-70EC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV800DT-70EC

• Lead Free Status / Rohs Status: Not Compliant

16. Physical Dimensions
16.1
46
TS 048—48-Pin Standard TSOP
Note
For reference only. BSC is an ANSI standard for Basic Space Centering.
PACKAGE
SYMBOL
JEDEC
D1
A1
A2
b1
c1
A
D
E
Θ
R
N
b
c
e
L
19.80
18.30
11.90
MIN
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
---
0˚
MO-142 (B) DD
0.50 BASIC
TS/TSR 48
20.00
18.40
12.00
NOM
1.00
0.20
0.22
0.60
48
---
---
---
---
---
---
20.20
18.50
12.10
MAX
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
8
S29AL008D
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS
ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD
PROTUSION IS 0.15mm (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR
PROTUSION SHALL BE 0.08mm (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX.
MATERIAL CONDITION. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT
LEAD TO BE 0.07mm (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10mm (.0039") AND 0.25mm (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM
THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
D a t a
S h e e t
S29AL008D_00_A11 February 27, 2009
3641 \ 16-038.10 \ 7.10.7