HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 156

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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Table 6.3
Note:
Rev. 3.00, 03/04, page 114 of 830
BRSTRM CS256E
0
1
*
0
1
0
1
In the burst ROM interface, the bus width is specified by the ABW bit in WSCR, the
number of full access states (wait can be inserted) is specified by the AST bit in WSCR,
and the number of access cycles in burst access is specified regardless of the AST bit
setting.
Bit Settings and Bus Specifications of Basic Bus Interface
CPCSE
0
1
0
1
0
1
0
1
Basic Extended
Area
Basic extended
area
ABW, AST,
WMS1, WMS0,
WC1, WC0
Burst ROM
interface*
ABW, AST,
WMS0, WC1,
WC0, BRSTS1,
BRSTS0
256-kbyte
Extended Area
Used as basic
extended area
ABW256, AST256,
WMS10, WC11,
WC10
Used as burst
ROM interface
ABW256, AST256,
WMS10, WC11,
WC10
Areas
CP Extended Area (Basic
Mode)
Used as basic extended
area
ABWCP, ASTCP, WMS21,
WMS20, WC21, WC20
Same as when CS256E = 0
Used as burst ROM
interface
ABWCP, ASTCP, WMS21,
WMS20, WC21, WC20
Same as when CS256E = 0

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