HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 170
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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(2) 8-Bit, 3-State Access Space: Figure 6.6 shows the bus timing for an 8-bit, 3-state access
space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used.
Wait states can be inserted.
Rev. 3.00, 03/04, page 128 of 830
Note:
* For external address space access, this signal is not output when the 256-kbyte expansion area
CS256 (CS256E = 1)
CPCS1 (CPCSE = 1)
is accessed with CS256E = 1 and when the CP expansion area is accessed with CPCSE = 1.
Read
Write
AS (IOSE = 0)
IOS (IOSE = 1)
Figure 6.6 Bus Timing for 8-Bit, 3-State Access Space
Address bus
*
D15 to D8
D15 to D8
D7 to D0
HWR
φ
RD
T
1
Bus cycle
T
2
Valid
T
3
Invalid
Valid
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