HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 314

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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Rev. 3.00, 03/04, page 272 of 830
Figure 10.3 Output Waveform (OS = 0, DADR corresponds to T
t
t
t
t
t
t
L1
f1
L1
L1
f1
L1
= t
+ t
= t
+ t
t
t
f1
f2
f1
f2
L2
L2
= t
= t
+ t
+ t
f3
f3
L3
= ··· = t
L3
= ··· = t
+ ··· + t
+ ··· + t
a. CFS = 0 [base cycle = resolution (T) × 64]
b. CFS = 1 [base cycle = resolution (T) × 256]
t
f63
t
f255
L2
L2
L63
L255
= t
t
= t
t
f2
f64
+ t
f2
+ t
f256
L64
= T× 256
L256
= T× 64
= T
= T
1 conversion cycle
L
1 conversion cycle
L
t
t
L3
L3
t
t
L63
L255
t
t
f63
f255
t
t
L64
L256
t
t
f64
f256
L
)

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