HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 34
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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Figure 20.7 Automatic-Bit-Rate Adjustment Operation of SCI ................................................. 639
Figure 20.8 Overview of Boot Mode State Transition Diagram................................................. 641
Figure 20.9 Programming/Erasing Overview Flow.................................................................... 642
Figure 20.10 RAM Map When Programming/Erasing is Executed ........................................... 643
Figure 20.11 Programming Procedure........................................................................................ 644
Figure 20.12 Erasing Procedure ................................................................................................. 649
Figure 20.13 Repeating Procedure of Erasing and Programming............................................... 651
Figure 20.14 Procedure for Programming User MAT in User Boot Mode ................................ 653
Figure 20.15 Procedure for Erasing User MAT in User Boot Mode .......................................... 654
Figure 20.16 Transitions to Error-Protection State..................................................................... 667
Figure 20.17 Switching between the User MAT and User Boot MAT ...................................... 668
Figure 20.18 Memory Map in Programmer Mode...................................................................... 669
Figure 20.19 Boot Program States.............................................................................................. 671
Figure 20.20 Bit-Rate-Adjustment Sequence ............................................................................. 672
Figure 20.21 Communication Protocol Format .......................................................................... 673
Figure 20.22 New Bit-Rate Selection Sequence......................................................................... 683
Figure 20.23 Programming Sequence......................................................................................... 686
Figure 20.24 Erasure Sequence .................................................................................................. 689
Section 21 Boundary Scan (JTAG)
Figure 21.1 JTAG Block Diagram.............................................................................................. 698
Figure 21.2 TAP Controller State Transitions ............................................................................ 714
Figure 21.3 Reset Signal Circuit Without Reset Signal Interference.......................................... 718
Figure 21.4 Serial Data Input/Output (1).................................................................................... 719
Figure 21.5 Serial Data Input/Output (2).................................................................................... 720
Section 22 Clock Pulse Generator
Figure 22.1 Block Diagram of Clock Pulse Generator ............................................................... 721
Figure 22.2 Typical Connection to Crystal Resonator................................................................ 722
Figure 22.3 Equivalent Circuit of Crystal Resonator.................................................................. 722
Figure 22.4 Example of External Clock Input ............................................................................ 723
Figure 22.5 Note on Board Design of Oscillation Circuit Section .............................................. 725
Section 23 Power-Down Modes
Figure 23.1 Mode Transition Diagram ....................................................................................... 736
Figure 23.2 Medium-Speed Mode Timing ................................................................................. 740
Figure 23.3 Software Standby Mode Application Example ....................................................... 742
Figure 23.4 Hardware Standby Mode Timing ............................................................................ 743
Section 25 Electrical Characteristics
Figure 25.1 Darlington Transistor Drive Circuit (Example)....................................................... 787
Figure 25.2 LED Drive Circuit (Example) ................................................................................. 787
Figure 25.3 Output Load Circuit ................................................................................................ 788
Figure 25.4 System Clock Timing.............................................................................................. 789
Figure 25.5 Oscillation Stabilization Timing.............................................................................. 790
Rev. 3.00, 03/04, page xxxii of xl
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