HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 654

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

• Programming/erasing protection
• Programmer mode
Rev. 3.00, 03/04, page 612 of 830
 User boot mode
Sets protection against flash memory programming/erasing via hardware, software, or error
protection.
This mode uses the PROM programmer. The user MAT and user boot MAT can be
programmed.
FWE pin
Mode pin
The user boot program of the optional interface can be made and the user MAT can be
programmed.
[Legend]
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
Note:
To read from or write to the registers, the FLSHE bit in the serial timer control
register (STCR) must be set to 1.
Flash code control status register
Flash program code select register
Flash erase code select register
Flash key code register
FMATS
FTDAR
FCCS
FPCS
FECS
FKEY
Figure 20.1 Block Diagram of Flash Memory
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
User MAT:
User boot MAT: 8 kbytes
256 kbytes (H8S/2168)
384 kbytes (H8S/2167)
512 kbytes (H8S/2166)
Memory MAT unit