HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 655

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

20.1.1
When each mode pin and the FWE pin are set in the reset state and reset start is performed, this
LSI enters each operating mode as shown in figure 20.2.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in boot mode, user
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
program mode, and user boot mode.
programmer mode.
User mode
Operating Mode
FLSHE = 0
→ FWE = 0
FWE = 1 →
FLSHE = 1
Figure 20.2 Mode Transition of Flash Memory
User program
mode
Reset state
On-board programming mode
User boot
Programmer mode setting
mode
RES = 0
Rev. 3.00, 03/04, page 613 of 830
Boot mode
Programmer
mode