HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 657

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

20.1.3
This LSI’s flash memory is configured by the 8-kbyte user boot MAT and 256-kbyte (H8S/2168),
384-kbyte (H8S/2167), or 512-kbytes (H8S/2166) user MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes. However, the user boot MAT can be
programmed only in boot mode and programmer mode.
The size of the user MAT is different from that of the user boot MAT. An address which exceeds
the size of the 8-kbyte user boot MAT should not be accessed. If the attempt is made, data is read
as undefined value.
Address H'07FFFF
Address H'000000
Address H'03FFFF
Address H'05FFFF
Flash Memory MAT Configuration
<User MAT>
Figure 20.3 Flash Memory Configuration
256 kbytes
(H8S/2168)
384 kbytes
(H8S/2167)
512 kbytes
(H8S/2166)
Address H'001FFF
Address H'000000
Rev. 3.00, 03/04, page 615 of 830
<User Boot MAT>
8 kbytes