HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 683

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

(Program end notice)
2.
4.
(reset by boot mode)
Wait for program data
Boot mode initiation
programming/erasing
setting command
Wait for inquiry
Figure 20.8 Overview of Boot Mode State Transition Diagram
3.
command
Wait for
user boot MAT erasure
(Program command reception)
(Erasure end notice)
All user MAT and
(Program data transmission)
H'00.......H'00 reception
H'00 transmission
Inquiry command response
(adjustment completed)
Inquiry command reception
Read/check command
reception
(Bit rate adjustment)
Command response
(Erasure selection command reception)
read/check command
Bit rate adjustment
Wait for erase-block
Processing of
inquiry setting
Processing of
command
data
Rev. 3.00, 03/04, page 641 of 830
(Erase-block specification)
1.