HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 699

no-image

HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2168VTE33
Manufacturer:
HIT
Quantity:
1 000
Part Number:
HD64F2168VTE33V
Manufacturer:
Renesas
Quantity:
8 400
Part Number:
HD64F2168VTE33V
Manufacturer:
RENESAS
Quantity:
112
Part Number:
HD64F2168VTE33V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Table 20.8 (1)
Item
Storage Area for
Program Data
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SCO = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Inhibit of
Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Program Parameter
Useable Area for Programming in User Program Mode
On-chip
RAM
Storable /Executable Area
User
MAT
×*
×
×
×
×
External Space
(Expanded Mode) User MAT
×
×
Rev. 3.00, 03/04, page 657 of 830
Selected MAT
Embedded
Program
Storage Area

Related parts for HD64F2168VTE33