HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 759
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2168VTE33V
Manufacturer:
Renesas
Quantity:
8 400
Company:
Part Number:
HD64F2168VTE33V
Manufacturer:
RENESAS
Quantity:
112
Part Number:
HD64F2168VTE33V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
- Current page: 759 of 876
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Notes: 1. Boundary scan mode does not cover power-supply-related pins (VCC, VCL, VSS,
2. Boundary scan mode does not cover clock-related pins (EXTAL, XTAL, and PFSEL).
3. Boundary scan mode does not cover reset- and standby-related pins (RES, STBY, and
4. Boundary scan mode does not cover JTAG-related pins (ETCK, ETDI, ETDO, ETMS,
5. Fix the MD2 pin high.
6. Use the STBY pin in high state.
AVCC, AVSS, and AVref).
RESO).
and ETRST).
Rev. 3.00, 03/04, page 717 of 830
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