HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 764
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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22.1
Clock pulses can be supplied either by connecting a crystal resonator or by providing external
clock input.
22.1.1
Figure 22.2 shows a typical method of connecting a crystal resonator. An appropriate damping
resistance R
should be used.
Figure 22.3 shows the equivalent circuit of a crystal resonator. A crystal resonator having the
characteristics given in table 22.2 should be used.
When PFSEL is high, the system clock (φ) frequency should be no more than 25 MHz and a
crystal resonator with frequency identical to that of the system clock (φ) should be used. When
PFSEL is low, a crystal resonator with ¼ times the frequency of the system clock (φ) should be
used.
Table 22.1 Damping Resistance Values
Frequency (MHz)
R
Rev. 3.00, 03/04, page 722 of 830
d
(Ω)
Oscillator
Connecting Crystal Resonator
d
, given in table 22.1, should be used. An AT-cut parallel-resonance crystal resonator
XTAL
Figure 22.2 Typical Connection to Crystal Resonator
Figure 22.3 Equivalent Circuit of Crystal Resonator
5
300
EXTAL
XTAL
L
R
8
200
d
C
C
L
0
C
C
AT-cut parallel-resonance crystal resonator
L1
L2
10
0
R
s
EXTAL
12
0
C
L1
= C
L2
= 10 to 22 pF
16
0
20
0
25
0
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