HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 834

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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25.3.2
Table 25.7 shows the control signal timing. Only external interrupts NMI, IRQ0 to IRQ15, KIN0
to KIN15, and WUE8 to WUE15 can be operated based on the subclock (φSUB = 32.768 kHz).
Table 25.7 Control Signal Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Rev. 3.00, 03/04, page 792 of 830
Item
RES setup time
RES pulse width
NMI setup time
NMI hold time
NMI pulse width
(exiting software standby
mode)
IRQ setup time
(IRQ15 to IRQ0, KIN15
to KIN0, WUE15 to
WUE8)
IRQ hold time
(IRQ15 to IRQ0, KIN15
to KIN0, WUE15 to
WUE8)
IRQ pulse width
(IRQ15 to IRQ0, KIN15
to KIN0, WUE15 to
WUE8) (exiting software
standby mode)
Control Signal Timing
RES
φ
Symbol
t
t
t
t
t
t
t
t
RESS
RESW
NMIS
NMIH
NMIW
IRQS
IRQH
IRQW
Figure 25.10 Reset Input Timing
Min.
200
20
150
10
200
150
10
200
t
RESS
Max.
t
RESW
Unit
ns
t
ns
cyc
t
RESS
Test Conditions
Figure 25.10
Figure 25.11

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