HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 836
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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Price
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Quantity:
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25.3.3
Table 25.8 shows the bus timing. In subclock (φSUB = 32.768 kHz) operation, external expansion
mode operation cannot be guaranteed.
Table 25.8 Bus Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Rev. 3.00, 03/04, page 794 of 830
Item
Address delay time
Address setup time
Address hold time
CS delay time (IOS,
CS256, CPCS1)
AS delay time
RD delay time 1
RD delay time 2
Read data setup time
Read data hold time
Read data access time 1 t
Read data access time 2 t
Read data access time 3 t
Read data access time 4 t
Read data access time 5 t
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time
Write data setup time
Write data hold time
WAIT setup time
WAIT hold time
Bus Timing
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AD
AS
AH
CSD
ASD
RSD1
RSD2
RDS
RDH
ACC1
ACC2
ACC3
ACC4
ACC5
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
Min.
0.5 × t
0.5 × t
10
15
0
1.0 × t
20
1.5 × t
20
0
0.5 × t
25
5
cyc
cyc
cyc
cyc
cyc
–15
–
–
–
– 5
Max.
15
15
15
15
15
1.0 × t
1.5 × t
2.0 × t
2.5 × t
3.0 × t
15
15
25
cyc
cyc
cyc
cyc
cyc
– 30
– 25
– 30
– 25
– 30
Unit
ns
Test Conditions
Figures 25.12 to 25.16
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