HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 841

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

T 1
T 2 or T 3
T 1
φ
t
AD
A23 to A0, IOS*
CS256, CPCS1
AS*
t
RSD2
RD
(Read)
t
t
t
ACC1
RDS
RDH
D15 to D0
(Read)
Note: * AS is multiplexed with IOS. Either the AS or IOS function can be selected by the IOSE bit of SYSCR.
Figure 25.16 Burst ROM Access Timing/1-State Access
Rev. 3.00, 03/04, page 799 of 830