HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 849

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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Table 25.11 I
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Note:
Item
SCL input cycle time
SCL input high pulse width t
SCL input low pulse width
SCL, SDA input rise time
SCL, SDA input fall time
SCL, SDA output fall time
SCL, SDA input spike
pulse elimination time
SDA input bus free time
Start condition input hold
time
Retransmission start
condition input setup time
Stop condition input setup
time
Data input setup time
Data input hold time
SCL, SDA capacitive load
*
17.5 t
2
C Bus Timing
cyc
or 37.5 t
cyc
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
C
SCL
SCLH
SCLL
Sr
Sf
Of
SP
BUF
STAH
STAS
STOS
SDAS
SDAH
can be set according to the clock selected for use by the IIC module.
b
Min.
12
3
5
20 + 0.1 C
5
3
3
3
0.5
0
b
Typ.
Max.
7.5*
300
250
1
400
Rev. 3.00, 03/04, page 807 of 830
Unit
t
ns
t
ns
pF
cyc
cyc
Test Conditions
Figure 25.30

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