HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 853

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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25.4
Table 25.14 lists the A/D conversion characteristics.
Table 25.14 A/D Conversion Characteristics
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, AVref = 3.0 V to AVCC
Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, AVref = 3.0 V to AVCC,
Notes: 1. Value when using the maximum operating frequency in single mode of 134 states.
Item
Resolution
Conversion time
Analog input capacitance 
Permissible signal-
source impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
2. Value when using the maximum operating frequency in single mode of 266 states.
A/D Conversion Characteristics
(AN7 to AN0 Input: 134/266-State Conversion)
VSS = AVSS = 0 V, φ = 5 MHz to 16 MHz
VSS = AVSS = 0 V, φ = 5 MHz to 33 MHz
Min.
Condition A
Typ.
10
Max.
8.38*
20
5
±7.0
±7.5
±7.5
±0.5
±8.0
1
Min.
Condition B
Typ.
10
Rev. 3.00, 03/04, page 811 of 830
Max.
8.06*
20
5
±7.0
±7.5
±7.5
±0.5
±8.0
2
Unit
Bits
µs
pF
kΩ
LSB

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