HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 867
HD64F2168VTE33
Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet
1.HD64F2168VTE33.pdf
(876 pages)
Specifications of HD64F2168VTE33
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2168VTE33V
Manufacturer:
Renesas
Quantity:
8 400
Company:
Part Number:
HD64F2168VTE33V
Manufacturer:
RENESAS
Quantity:
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Part Number:
HD64F2168VTE33V
Manufacturer:
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Quantity:
20 000
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14-bit PWM timer (PWMX)................... 261
16-bit count mode................................... 326
16-bit free-running timer (FRT) ............. 277
16-bit, 2-state access space ..................... 129
16-bit, 3-state access space ..................... 132
256-kbyte expansion area ....................... 116
8-bit PWM timer (PWM)........................ 251
8-bit timer (TMR) ................................... 305
8-bit, 2-state access space ....................... 127
8-bit, 3-state access space ....................... 128
A/D conversion time............................... 602
A/D converter ......................................... 595
ABRKCR.......................... 75, 755, 766, 777
Absolute address....................................... 44
Acknowledge .......................................... 466
Activation by interrupt............................ 173
Activation by software............................ 173
ADCR ............................. 600, 760, 771, 781
ADCSR........................... 599, 760, 771, 781
Additional pulse...................................... 259
ADDR............................. 598, 759, 771, 780
Address map ............................................. 60
Address ranges and external address
spaces...................................................... 113
Address space ........................................... 22
Addressing modes..................................... 43
ADI ......................................................... 604
Advanced mode ...................................... 122
Arithmetic operations instructions............ 34
Asynchronous mode ............................... 380
BARA ............................... 76, 755, 766, 777
BARB ............................... 76, 755, 766, 777
BARC ............................... 76, 755, 766, 777
Basic expansion area............................... 115
Basic operation timing............................ 145
Basic pulse.............................................. 258
Index
Bit manipulation instructions .................... 37
Bit rate..................................................... 369
Block data transfer instructions................. 41
Block transfer mode ................................ 168
Boot mode............................................... 638
Boundary scan......................................... 715
Branch instructions ................................... 39
BRR ................................ 369, 759, 770, 780
Burst ROM interface............................... 145
Bus specifications of basic bus
interface .................................................. 114
Carrier frequency .................................... 253
Cascaded connection............................... 326
Chain transfer.......................................... 169
Clock pulse generator ............................. 721
Clocked synchronous mode .................... 399
CMIA ...................................................... 329
CMIA0 .................................................... 329
CMIA1 .................................................... 329
CMIAX ................................................... 329
CMIAY ................................................... 329
CMIB ...................................................... 329
CMIB0 .................................................... 329
CMIB1 .................................................... 329
CMIBX ................................................... 329
CMIBY ................................................... 329
Communications protocol ....................... 672
Compare-match count mode ................... 326
Condition field .......................................... 41
Condition-code register............................. 26
Conversion cycle..................................... 269
CP expansion area (basic mode) ............. 117
CPU........................................................... 15
CPU operating modes ............................... 18
CRA ........................................................ 154
CRB ........................................................ 154
CRC operation circuit ............................. 428
CRCCR ........................... 429, 754, 765, 776
CRCDIR.......................... 429, 754, 765, 776
Rev. 3.00, 03/04, page 825 of 830
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