HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 94

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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2.9.3
1. EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4*,
2. Set R4* and ER6 so that the end address of the destination address (value of ER6 + R4*) does
Note: * For byte transfer R4L is used.
Rev. 3.00, 03/04, page 52 of 830
which starts from the address indicated by ER5, to the address indicated by ER6.
not exceed H'00FFFFFF (the value of ER6 must not change from H'00FFFFFF to H'01000000
during execution).
ER5 + R4*
EEPMOV Instruction
ER5 + R4*
ER5
ER5
Invalid
H'FFFFFFF
ER6
ER6 + R4*
ER6
ER6 + R4*

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