TFA9882 NXP Semiconductors, TFA9882 Datasheet - Page 27

• Manufacturer Part Number: TFA9882
• Description: The TFA9882 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP (WaferLevel Chip-Size Package) with a 400 µm pitch
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TFA9882
Product data sheet
15.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
Cleaning can be done after reflow soldering.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 April 2011
3.4 W I2S input mono class-D audio amplifier
TFA9882
© NXP B.V. 2011. All rights reserved.
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